【Welcome】The packaging and testing industry is thriving

In 2019, Huawei HiSilicon's packaging and testing supply chain returned, and my country's packaging and testing industry is thriving. The Core Thought Research Institute estimates that the packaging and testing industry will achieve a growth of about 16%.

In 2019, we completed several packaging and testing projects. In 2020, my country's packaging and testing capacity will be further improved, which will inevitably drive the further expansion of the scale of packaging and testing.

At present, domestic FOPLP packaging, high-performance RF packaging and Chiplet technologies have been laid out, and with the further return of Huawei HiSilicon's packaging and testing supply chain, my country's packaging and testing technology will be further improved.

And with the improvement of packaging technology, professional third-party testing will develop rapidly.

Let's take a look at what people in the packaging industry say.

Wang Xinchao, Chairman of Jiangsu Xinchao Technology Group Co., Ltd.

Xu Linhua, Executive Vice President of Yongsi Electronics (Ningbo) Co., Ltd.

Yu Daquan, President of Xiamen Yuntian Semiconductor Technology Co., Ltd.

Zhang Yifeng, CEO of Guangdong Liyang Chip Testing Co., Ltd.

2019 is the year when the board-level fan-out packaging process began to be applied in batches, and it is also a year of great strides for Zhongke Sihe Company.

Zhongke Sihe is committed to building a board-level discrete device fan-out packaging process manufacturing platform, and based on this platform, it conducts research on advanced fan-out packaging process technology and discrete device/module product research. After four years of research and development, Zhongke Sihe has completed the development and mass production of low-pin-count discrete device board-level fan-out packaging technology. In Q4 2019, the monthly production capacity of DFN packaging products has reached 180KK. The mass production package sizes include DFN0603, DFN1006, DFN2510, DFN3x3, etc. The product reliability meets the automotive-grade AEC-Q101 standard. The mass production product types cover TVS devices, Schottky diodes, etc. At present, single-chip and multi-chip integrated MOSFET products, power modules, GaN modules and other products are under development.

In 2020, Zhongke Sihe will continue to increase the mass production capacity of board-level fan-out packaging technology. The monthly production capacity of DFN packaging will exceed 300KK in Q3 2020. The mass production product types will be expanded from diode products to MOSFET product lines, and the operating income will achieve a small goal of 100 million yuan.

Based on the strategic cooperation between the Institute of Microelectronics of the Chinese Academy of Sciences and Shenzhen South Circuit, Shenzhen Zhongke Sihe Technology Co., Ltd. (hereinafter referred to as Zhongke Sihe) was established in 2014 and is headquartered in Shenzhen. It is currently a national high-tech enterprise and a Shenzhen high-tech enterprise. One of the founding shareholders of the Guangdong Semiconductor Intelligent Equipment and System Integration Innovation Center.

Wang Xinchao, Chairman of Jiangsu Xinchao Technology Group Co., Ltd.

2019 is about to pass, and a new era is about to come. These years have been an exciting time for the development of China's semiconductor industry. Not only has the country and society supported and invested in the semiconductor industry on a large scale, but the turbulent international situation has made the global semiconductor industry in 2019 and the new era more full of unprecedented opportunities and challenges.

In this day of bidding farewell to the old and welcoming the new, looking back on 2019, there are two themes for the semiconductor industry: one is the comprehensive and rapid rise of the domestic semiconductor industry chain; the other is the arrival of the 5G era. Following the ZTE incident, the United States swung the big stick of sanctions against Huawei, the benchmark of China's high-tech industry, in 2019. But this time, a completely different result was produced - not only did Huawei not fall, but it also aroused the whole society's attention to semiconductors, which in turn made my country's entire semiconductor industry chain boil. The newly opened Science and Technology Innovation Board has become the main show for the first emerging semiconductor companies. Starting from design companies, it has promoted the comprehensive revival of the domestic industrial chain from top to bottom, and all links in the industrial chain have gained unprecedented opportunities and development. However, looking at the world, under the situation of growing trade protectionism, global economic growth is weak and crises are everywhere. The smartphone market continues to be sluggish. According to data released by several market research institutions, the global mobile phone market has not escaped the curse of decline in the first three quarters, and it is likely that the mobile phone market will continue to decline slightly throughout the year. Affected by this, the global semiconductor industry suffered a sharp decline in the first half of 2019. The full rebound in the second half of the year driven by 5G may pull the whole year back to the positive growth range. All for this year's semiconductor industry, 5G's contribution is indispensable. The comprehensive deployment of major operators and the full 5Gization of flagship products of major mobile phone chip suppliers have injected a shot in the arm to the originally sluggish semiconductor industry.

Looking ahead to 2020, 5G will continue to penetrate and enter the mainstream of mid-to-high-end mobile phones, bringing a new wave of replacement. At the same time, 5G's demand for high-performance RF and power management chips has soared, and its promotion of the semiconductor industry has become broader, especially the business opportunities brought to companies in the analog and RF related fields cannot be ignored. As a result, new requirements have been put forward for each link of semiconductor equipment, materials, manufacturing and packaging and testing. In addition to 5G, artificial intelligence (AI) will continue to develop, from intelligent manufacturing in industrial production to the assistance and improvement of people in all aspects of social life, to new applications such as AR/VR on our mobile phones, all of which are the products of AI development. AI has also posed a very big challenge to the semiconductor industry, especially the production of high-performance and low-power chips required for AI. The boundaries between the manufacturing and packaging and testing processes of chip manufacturing are becoming increasingly blurred, and the demand for system integration is emerging, and chiplets will soon become a reality. This trend will drive the entire semiconductor industry chain, from EDA tools to design, from equipment materials to manufacturing and packaging and testing, into a new era. 2020 is the beginning of this era.

Xu Linhua, Executive Vice President of Yongsi Electronics (Ningbo) Co., Ltd.

In the long history of China's semiconductor industry development, the year 2019, which is about to pass, will definitely leave a strong mark. Against the backdrop of the Sino-US game, in this war without gunpowder, the semiconductor field in the high-tech industry has become the Shangganling on the battlefield, and Huawei has been defined by the United States as the primary target of precision strikes. History has always been like this. It seems that there is no way out, but in fact, it is about to usher in a bright future. As expected, under the support and guidance of national industrial policies and the strong promotion of the general trend of "localization" of the industrial chain, highlights such as 5G/pan-IOT/artificial intelligence have concentrated on breaking out. Entering the second half of the year, China's integrated circuit industry is thriving, the market is strong, production capacity is in short supply, and industry and capital are developing rapidly, sweeping away the haze at the beginning of the year.

I remember that at the beginning of 2019, the economic situation was shrouded in dark clouds, the integrated circuit industry continued to decline, and the uncertainty about the future filled the industry with a certain degree of pessimism. At that moment, Yongsi Electronics had just been established for a year. Although it was full of hope for the industry prospects and its own strength was beyond doubt, it was a startup company. Once the arrow is shot, there is no turning back. The entrepreneurial team of Yongsi Electronics has firm confidence and has forged ahead with the construction of SiP, BGA, QFN, and MEMS high-end integrated circuit packaging and testing lines. By the end of 2019, the total investment for the whole year exceeded RMB 1.3 billion, and the annual sales reached nearly RMB 400 million. The monthly high-end integrated circuit packaging and testing manufacturing capacity reached 180 million pieces, and the monthly sales exceeded RMB 70 million. While the company has achieved great results, it has also made great contributions to the localization of the industrial chain.

Looking forward to 2020, the first golden decade of China's integrated circuit industry is still in its infancy. In our domestic customer base and application fields such as SoC, RF, PMIC, and Sensor, there are many heroes who are struggling to strengthen the country with science and technology and serve the country with industry. I am often moved and excited by this. While achieving the pursuit of team, individual material and spiritual levels, I believe that national rejuvenation and national prosperity are just around the corner.

Yongsi has won the support of new and old friends in the industry and many customers. Therefore, we can only live up to the trust and love of friends in the industry by promising integrity, working hard and forging ahead! 2020 goal: customer satisfaction, double performance, Yongsi, come on, everyone come on!

Yu Daquan, President of Xiamen Yuntian Semiconductor Technology Co., Ltd.

2019 is the 70th anniversary of the founding of the People's Republic of China. The National Day military parade makes every Chinese feel inspired, excited and proud against the background of Sino-US friction.

2019 is a very critical year for the development of domestic semiconductors. The Sino-US trade war began to intensify, and the two sides drew their swords against each other. By the end of the year, it gradually eased and reached an agreement. The entire domestic semiconductor industry has also gone from cold wind and rain to prosperity. The escalation of friction in the global market has made us see more clearly that the core technology of semiconductors must be in our own hands. The US sanctions on Huawei have accelerated the construction of the domestic independent industrial chain; Japan's export ban on South Korea has shown us that core materials cannot be controlled by others. In 2019, the Science and Technology Innovation Board was born, and the second phase of the Big Fund was established, which will promote the rapid rise of the domestic chip industry chain.

With the advent of 5G applications, the market for RF front-end devices will soon reach more than 30 billion US dollars, while my country's current market share is less than 5%, a huge gap. In view of the current situation that domestic RF front-end technology and industrialization are controlled by others, the domestic industrial chain needs to carry out collaborative innovation in design, manufacturing and packaging to solve the bottleneck problem. In 2019, Xiamen Yuntian Semiconductor completed the construction of the R&D line and began to carry out cooperative R&D and foundry services with domestic RF companies. Faced with many difficulties and challenges, the team overcame difficulties and developed three-dimensional packaging technology for surface acoustic filter, three-dimensional integration technology for glass through hole, 77GHz and above millimeter wave fan-out integration technology and high-Q inductor IPD integration technology in the packaging and integration of 5G RF devices. Among them, many technologies have reached the international leading level and are constantly being used in customer products.

Looking ahead to 2020, the development of the domestic semiconductor industry is booming. The demand for 5G applications is about to open the floodgates, and the battle for localization of RF devices has entered a critical period. Follow the trend, integrate into the great torrent of national industrial development, seize the rare opportunity for change, use our innovative technologies and products to better serve RF front-end products, and contribute to the healthy development of the domestic 5G RF industry chain ecosystem.

Zhang Yifeng, CEO of Guangdong Liyang Chip Testing Co., Ltd.



The sun and the moon wax and wane, and the stars are lined up. Winter comes and summer goes, and autumn harvests and winter stores. The year of Ji Hai that is about to pass is really a year of ups and downs. With the once-in-a-decade downward cycle of the semiconductor industry chain, the industry as a whole started in a sad state in the first quarter, accompanied by the Sino-US trade frictions and sales bans throughout the year, and the crazy price growth of the second brother... In the end, due to the comprehensive factors of domestic substitution, the establishment of the Science and Technology Innovation Board, and 5G commercial use, it quickly came out of the trough and ushered in a turning point, and strongly came out of a wave of unexpected explosive market, which made the entire industry chain excited.

In 2019, the sales of the domestic chip design industry are expected to reach 308.49 billion yuan, crossing the 300 billion yuan mark for the first time, an increase of 19.7% from 257.70 billion yuan in 2018, and it is expected to account for more than 10% of the global integrated circuit product sales revenue for the first time. With the continuous investment of the "National Integrated Circuit Development Outline", "Made in China 2025" and the second phase of the National Big Fund, the rise of the entire Chinese chip industry chain has become an irreversible trend.

Based on the proportion of chip testing to chip cost of 5-10%, the test output value of domestic chips has reached 15-30 billion yuan. However, due to the serious shortage of domestic third-party professional chip testing capacity, chip testing is currently undertaken by the entire industry chain, and some tests have to be outsourced to professional testing factories overseas. With the advancement of the localization process, advanced process products are increasingly dependent on testing. In the near future, we will usher in a chip testing market worth tens of billions of dollars, and we urgently need people of insight in the industry to join in the celebration.

Founded in 2010, Li Yang Chip is the largest professional testing solution provider for integrated circuit chips in China (domestic capital). Its main businesses include integrated circuit test solution development, wafer CP testing services, finished product FT testing services, and supporting services related to integrated circuit testing. Li Yang Chip is a typical representative and loyal practitioner of "independent third-party testing foundry" under the professional division of labor business model of the semiconductor industry. It undertakes a crucial link in the four core steps of design, manufacturing, packaging and testing in the integrated circuit industry chain. It is a key link in the complete testing and verification of chips before they are delivered to terminal applications. The company focuses on being a gatekeeper to ensure the quality and quantity of chips delivered on time. Li Yang Chip has the ability to develop Turnkey customized test programs to fully meet the testing needs of chips of different application types.

Li Yang Chip took the lead in deploying 12-inch wafer scale testing capacity at the beginning of the company's establishment, and realized the mass production testing of many leading chips in the industry's subdivisions at an early stage. It has accumulated more than 2,200 chip test solutions that have been mass-produced and obtained more than 80 patent authorizations. The company has continuously strengthened its R&D investment and expanded its testing capacity, accurately grasped the general trend of the transfer of the chip industry to localization and the hot opportunities of the explosive growth of blockchain chips, and ushered in an opportunity for explosive vertical growth. The production capacity planned in the early stage has been fully utilized, and the highest equipment transfer efficiency in the industry has achieved an annual performance growth of more than 60%, and the operating profit has increased several times.

In particular, the company's AI high-computing chip testing solution for the world's leading 7nm advanced process manufacturing perfectly solves the problem of discrete chip yield caused by the instability of high-end processes. The company directly participates in the research and development and customization of equipment, creatively conducts multi-dimensional research on massive test big data, and continuously optimizes targeted special test solutions, guides the adjustment of front-end wafer manufacturing and packaging processes, and effectively classifies and screens various indicators with large current, deep vectors, and discrete performance parameters through highly customized test solutions, meeting the scenario of hundreds of chips in series power supply in its terminal applications, and providing chip products with completely consistent parameters and performance such as leakage current, operating frequency, and reliability, so that this series of chips has increased from a fluctuating yield of 50-80% to an average yield of 99%.

The reincarnation of Gengzi, the rat bites the sky. We are about to usher in the 20s of the 21st century, and China's chip industry will also enter the 2.0 stage. First of all, we will see the change of business model. On the basis of existing IDM and FOUNDRY foundry, Chipless model has become a new force. Taking Huawei HiSilicon as an example, emerging design forces such as Alibaba Pingtou Ge and Gree Zero Boundary will further erode the market share of the vertically integrated IDM model by relying on the huge terminal demand and brand effect of their parent companies. Secondly, the outbreak of the wearable market has found a new entrance for the Internet of Everything. TWS has already tried its hand in 2019. Smart wearables may become the third core application that triggers the leap of the entire industry chain after PC and mobile Internet.

Looking to the future, China's semiconductor industry is about to usher in a golden 15 years of sustained explosive growth. With the steady advancement of the national strategy of chip localization, the construction of new wafer foundries will bring an increase of one million WAFER/M, and the high-end chip research and development and marketing capabilities of chip design companies will continue to improve. The huge testing market of tens of billions of US dollars will put forward higher requirements for professional testing companies.

2020 will also be an important year for Li Yang Chip to undergo a complete transformation and thrive.

We are committed to becoming a benchmark in the domestic third-party professional testing industry! Benefit national brands and promote the Chinese core. Liyang Chip is committed to revitalizing the national integrated circuit industry, creating a first-class domestic chip testing brand, and aspiring to become the world's largest semiconductor testing base. The company will always keep its mission in mind, take independent third-party integrated circuit testing and development as its main business, and on the basis of maintaining the original advantageous testing platform, further actively deploy high-end chip testing equipment, develop testing technology solutions, improve team management capabilities, and deploy 5G, AI, IoT, MEMS, Automotive, Memory, RF, FPGA and other high-end chip testing technology solutions, seize the irreversible trend of localization transfer of the chip industry, become bigger and stronger, and continue to help China's core!

Author: Core Thought
Link: https://xueqiu.com/7814068463/140103075
Source: Snowball
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