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FLT-3201 Chip Dynamic Aging Test System

▲Device descriptionDevice name: Chip dynamic aging test systemDevice model: FLT-3201Manufacturer: Shanghai Philai Testing Technology Co., Ltd.▲Key features· Support constant temperature hot air circulation in the test chamber and water circulation heat dissipation outside the chamber· Support indepe...
Product Introduction
Product parameters

▲Device description

Device name: Chip dynamic aging test system

Device model: FLT-3201

Manufacturer: Shanghai Philai Testing Technology Co., Ltd.

▲Key features

· Support constant temperature hot air circulation in the test chamber and water circulation heat dissipation outside the chamber

· Support independent temperature control of a single socket

· Support power-on timing configuration and step-by-step power-on

· Support configurable overvoltage, undervoltage, overcurrent and other protection strategies

· Support test vector loading, output and error detection

· Support test vector data readback, analysis and report generation

· Support chip connectivity based on power supply and test vector before aging

· Support test data and log information timed local and central server storage and backup

· Support real-time graphical display of product operation status and test data

· Support the formulation of multi-step test plans according to different test conditions, and run with one click

· Support multi-level permissions and functions for operators, engineers, engineering debugging, and system management

· Function control

· Support MES, SECS/GEM access and function customization

· Support test program central server control and download

· Support hierarchical execution of continue, pause, stop and other strategies according to abnormal scenarios

· Support data recovery and test in scenarios such as factory power outage, emergency stop, abnormal software shutdown, etc.

· Test recovery

· Support abnormal information summary and query



Equipment specification

Ordinal number

project

parameter

1

Machine model

FLT-3201

2

Test IC power

A single device <150 W

3

Temperature control method

Socket independent temperature control

4

Aging temperature

RT+20 ° C -150C °

5

Warm zone

1

6

Number of temperature control channels

twenty four

7

Temperature control power specification

24V/60W

8

Old mana slot

16

9

Old -fashioned

570mm × 609mm

10

Number of single -aged products

4-24 (related to Socket size)

11

Equipment production

64-384 DUT

12

Single -old old board power channel

DPS1-8: 0-8V/25A, 100W

13

Power settings resolution

DPS9-16: 0-4V/125A, 250W

14

Voltage setting accuracy

1MV

15

Voltage sampling accuracy

0.5%F.S. ± 0.05V

16

Current sampling accuracy

0.5%F.S. ± 0.05V

17

Remote sampling of power supply

DPS1-8: 0.5%F.S. ± 0.1A

18

Power remote adjustment

DPS9-16: 0.5%F.S. ± 0.5A

19

Power protection

support

20

IO channel

support

21

IO function

OCP, OVP, UVP (power off)

22

IO frequency

128

23

IO driver current

Full two -way, all support comparison

24

IO VIH

10MHz

25

IO VIL

100mA

26

Vector zone

0.5-4.8V can be adjusted, 4 groups can be configured

27

Vector format

0V

28

Vector memory

Each aging board runs separately

29

Vector depth

WGL, Stil, VEC, ATP, PAT, etc.

30

Support code type

4GB

31

Clock Timing Set

> 32M

32

Error record depth

Ro, RZ, NRZ

Factory demand

Serial number


parameter

Device size L*W*H

mm

3000 * 1650 * 2350

Land occupation

mm

4500 * 3700

L*w

kg

1600kg

Equipment weight

V

380v 50Hz

Voltage

A

75

Current

kw

50

Rated power

<23 (not frozen)

Plant water temperature

MPa

0.5-0.6

Water supply pressure

L/min

60L/min

Plant water flow


1 "

Water pipe


1 "

Outlet pipe

5-40

Run temperature

%

80%no condensate

 


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18688779380

Address:RoomE501, 5F, No.1 building, No.6111 Longdong Avenue, Pudong New District, Shanghai City
E-mail:eric.liu@feedlitech.com