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FLT-3301 Chip Dynamic Aging Test System

▲Device descriptionDevice name: Chip dynamic aging test systemDevice model: FLT-3301Manufacturer: Shanghai Philai Testing Technology Co., Ltd.▲Key features· Supports constant temperature hot air circulation in the test chamber and water circulation heat dissipation outside the chamber· Supports inde...
Product Introduction
Product parameters

▲Device description

Device name: Chip dynamic aging test system

Device model: FLT-3301

Manufacturer: Shanghai Philai Testing Technology Co., Ltd.

▲Key features

· Supports constant temperature hot air circulation in the test chamber and water circulation heat dissipation outside the chamber

· Supports independent temperature control of a single socket

· Supports power-on timing configuration and step-by-step power-on

· Supports configurable overvoltage, undervoltage, overcurrent and other protection strategies

· Supports test vector loading, output and error detection

· Supports test vector data readback, analysis and report generation

· Supports judging the connectivity of the chip based on the power supply and test vector before aging

· Supports timed local and central server storage and backup of test data and log information

· Supports real-time graphical display of product operation status and test data

· Supports the formulation of multi-step test plans based on different test conditions and one-click operation

· Supports multi-level permissions and function control for operators, engineers, engineering debugging, and system management

· Support MES, SECS/GEM access and function customization

· Support test program central server control and download

· Support hierarchical execution of continue, pause, stop and other strategies according to abnormal scenarios

· Support data recovery and test recovery in scenarios such as factory power outage, emergency stop, abnormal software shutdown, etc.

· Support abnormal information summary and query



Ordinal number

project

Equipment specification

1

Machine model

 parameter

2

Test IC power

FLT-3301

3

Temperature control method

A single device <300 W

4

Aging temperature

Socket independent temperature control

5

Warm zone

RT+20 ° C -150C °

6

Number of temperature control channels

1

7

Temperature control power specification

twenty four

8

Old mana slot

24V/60W

9

Old -fashioned

16

10

Number of single -aged products

570mm × 609mm

11

Equipment production

4-24 (related to Socket size)

12

Single -old old board power channel

64-384 DUT

13

Power settings resolution

DPS1-16: 0-8V/25A, 100W

14

Voltage setting accuracy

DPS17-24: 0-4V/125A, 250W

15

Voltage sampling accuracy

1MV

16

Current sampling accuracy

0.5%F.S. ± 0.05V

17

Remote sampling of power supply

0.5%F.S. ± 0.05V

18

Power remote adjustment

DPS1-16: 0.5%F.S. ± 0.1A

19

Power protection

DPS17-24: 0.5%F.S. ± 0.5A

20

IO channel

support

21

IO function

support

22

IO frequency

OCP, OVP, UVP (power off)

23

IO driver current

128

24

IO VIH

Full two -way, all support comparison

25

IO VIL

10MHz

26

Vector zone

100mA

27

Vector format

0.5-4.8V can be adjusted, 4 groups can be configured

28

Vector memory

0V

29

Vector depth

Each aging board runs separately

30

Support code type

WGL, Stil, VEC, ATP, PAT, etc.

31

Clock Timing Set

4GB

32

Error record depth

> 32M



Factory demand

 

Serial number

Project

parameter

Device size L*W*H

mm

3000 * 1650 * 2350

Land occupation

mm

4500 * 3700

L*w

kg

1600kg

Equipment weight

V

380v 50Hz

Voltage

A

125

Current

kw

83

Rated power

<23 (not frozen)

Plant water temperature

MPA

0.5-0.6

Water supply pressure

L/min

60L/min

Plant water flow


1 "

Water pipe


1 "

Outlet pipe

5-40

Run temperature

%

80%no condensate

 


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18688779380

Address:RoomE501, 5F, No.1 building, No.6111 Longdong Avenue, Pudong New District, Shanghai City
E-mail:eric.liu@feedlitech.com